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Thermal Pad Pro 導熱片

Cooler Master新的導熱片Thermal Pad Pro產品為一創新的產品。設計給您搭配所有您可能使用到的電子裝置。

COOLING VERSATILITY EVERYWHERE

THERMAL PAD PRO

Formulated with Nano Diamond Particles
Non-toxic and Non-corrosive
Double-sided Adhesive
Versatile and Easy Application.
Cooler Master's new Thermal Pad Pro is an innovative solution to device cooling for a vast range of your electronic devices and components.

COOLING VERSATILITY EVERYWHERE

FORMULATED WITH NANO DIAMOND PARTICLES

15.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.

NON-TOXIC
AND NON-CORROSIVE

Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.

DOUBLE-SIDED ADHESIVE

Provides seamless and secure contact between surfaces.

VERSATILE AND EASY APPLICATION

Easily cut to the perfect size for your application. Choices of 1mm and 2mm thickness are available.

WIDE RANGE OF APPLICATION

Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.

Tech specifications

Discover technical info about the product

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