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Thermal Pad 導熱片

Cooler Master新的導熱片Thermal Pad 產品為一創新的產品。設計給您搭配所有您可能使用到的電子裝置。

THERMAL PAD

Cooler Master's new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components.

FORMULATED WITH NANO ELEMENTS

13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.

NON-TOXIC AND NON-CORROSIVE

Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.

DOUBLE-SIDED ADHESIVE

Provides seamless and secure contact between surfaces.

WIDE RANGE OF APPLICATION

Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.

VERSATILE AND EASY APPLICATION
Tech specifications

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