THERMAL PAD
Cooler Master's new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components.
Cooler Master新的導熱片Thermal Pad 產品為一創新的產品。設計給您搭配所有您可能使用到的電子裝置。
Cooler Master's new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components.
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
Provides seamless and secure contact between surfaces.
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
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